Features:
- General Purpose Memory: EMIF
- DSP Peak MMACS: 400
Vendor:
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 69.445mm² (107640mil²)
Request Pad Layout
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 69.445mm² (107640mil²)
Request Pad Layout
Product Families: Used for this device are tabulated below.
Functional:
- DMA: 16 (EDMA)Ch
- DSP: 1 C67x
- DSP Instruction: Floating Point
- McASP: 1
- McBSP: 2
- Operating Systems: DSP/BIOS
Specification:
VS (IO): 3.3V
DSP MHz(Max): HPI: L1 Cache: 64KB
L2 Cache: 512KB
DSP MHz(Max): HPI: L1 Cache: 64KB
L2 Cache: 512KB
Other Detail: Important information for this device is tabulated below.
Traffic light setting for Minimum Order Quantity indicates the following:
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
Traffic light setting for High Reliability indicates the following:
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
Traffic light setting for Space Grade indicates the following:
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.
